High-density assembly, module assembly, and embedded component board assembly services.
0201 implementation contributes to manufacturing products for ultra-high-density mounting, module mounting, and embedded component substrates with a minimum gap of 0.1mm.
JOHNAN DMS Corporation contributes to our customers' manufacturing through product miniaturization and modularization. We provide a consistent system from product conceptual design to circuit board assembly, product assembly, and quality inspection. We can accommodate customer requests from implementation technology development to contract manufacturing. We also have a manufacturing base in Thailand and offer EMS services. ■ SMT Mounting Capability (Surface Mount Technology) 【Precision】 Reflow: chip 0201, chip 0402 Reflow & Flow (Bond Mounting): chip 0603 and above 【Supported Chips】 BGA, SOP, QFP, LED, QFN, etc. 【Supported Sizes】 Maximum size: 250mm × 330mm, board thickness: 0.5mm to 1.6mm (MAX: 5.0mm) ■ Chip Mounting 0201 chip mounting, 0201 mounting with a minimum gap of 0.1mm. High effectiveness is expected for ultra-high-density mounting, module mounting, and component-integrated circuit board mounting. ■ COB Mounting (Chip On Board) 【Mounting Capability】 0.2mm to 10mm Post-mounting of COB substrates. Cream solder application is possible using a dispenser. For more details, please refer to the related links.
- Company：JOHNAN DMS
- Price：Other
